2027 International Conference on Thermosetting Resin Applications

Abstract Submissions

1. Development and application trends of resins and their core monomers, including epoxy resin, phenolic resin, acrylic acid, cyanate ester, BMI, polyimide, etc.

2. Development and application of curing agents such as amines, acid anhydrides, phenolic resins, latent curing agents, high-temperature resistant and flame-retardant curing agents.

3. Research on new technologies, applications and hot issues such as toughening, flame retardancy, emulsification, thermal conductivity, recyclability and biodegradability.

4. Research and application of advanced manufacturing technologies, including low-temperature/photo/rapid curing, solvent-free low-VOC processes, winding, pultrusion, 3D printing and other technologies.

5. Development, application and market trends of resin systems for aerospace, new energy, electronics and electrical engineering, new infrastructure, semiconductors, rail transit, marine engineering, etc.

6. Industrial policies, environmental regulations, macroeconomics and market analysis & forecasts related to the industry.